• 3.5-inch LGA1200 motherboard for AI and Edge projects


  • This 3.5-inch subcompact board from AAEON Technology provides a LGA1200 socket which allows you to easily scale across multiple 10th Gen. Intel Core CPUs. The boards offers flexibility, expandability and desktop performance in a compact form factor.
  • Power efficient AI and IoT platform with 5G support


  • The UP Squared Pro, from AAEON’s UP Bridge the Gap brand, provides speed, intelligence, and flexibility to industrial-level AI & IoT applications with intense media processing capabilities, while also being extremely power-efficient.
  • Google Edge TPU AI Edge computing solution


  • The BOXER-8521AI from AAEON Technology combines the innovative Google® Edge™ TPU with PoE PD flexibility and a broad I/O loadout including 40-pin multi-I/O. Its rugged fanless design allows the system to operating in temperatures from -5°C to 50°C.
  • Cutting-edge 5G antenna with superior performance


  • The 2JW1683 “KATANA” from 2J Antennas, is a very small 5G NR monopole antenna with superior performance across sub-6 GHz frequencies. Measuring only Ø 10x80mm, this simple plug-and-play antenna enhances mobile broadband (eMBB) and ultra-reliable low-latency communications (URLLC). It is designed for mobile devices operating within 5G NR / 4GLTE / FirstNet / CBRS / LPWA / CAT-X / CAT-Mx / CAT-NBx / NB-IoT standards.
  • PICO-ITX with 8th Gen Intel CPU


  • The PICO-WHU4 from AAEON is the only compact PICO-ITX board with 8th Generation Intel® Core™ processors built for AI and Edge applications. This board support up to 16 GB of RAM, and comes with a brilliant set of I/O features. In addition it supports expansion cards like AI Core X with Intel® Movidius® Myriad™ X for even more AI@Edge processing power.
  • Built for AI at the edge


  • Thanks to asynchronous processing support, powered by Intel® Atom™ x5 E3940 and two Intel® Movidius® Myriad™ X VPU modules, the VPC-3350AI from AAEON provides faster and smoother AI processing compared to similar systems.
  • Flexible LTE connectivity for industrial IoT


  • The Cinterion LTE Cat 1, Cat 3, and Cat 6 mPCIe cards from Gemalto provide global coverage and reliability with optional 2G / 3G fallback when needed. These module series deliver instant access to LTE cellular networks for a range of industrial IoT applications and are very easy to integrate by simply plugging into an existing 52-pin express card slot.
  • Embedded ultra-compact Artificial Intelligence processing cards


  • AAEON has launched the AI Core. An embedded ultra-compact Artificial Intelligence processing cards for edge computing. The AI Core is a mini-PCIe module powered by Intel® Movidius™ Myriad™ 2 technology, together with the UP Squared the developers can build an application that will contribute to an intelligent industry
  • Compact multi band LTE CAT1/CAT4 modules


  • The SIM7600E and SIM7600E-H from SIMCom are multi-band LTE/HSPA+/GSM modules. These modules have strong extension capability with rich interfaces including UART, USB2.0, GPIO etc. The SIM7600E supports LTE CAT1 up to 10Mbps (DL) while the SIM7600E-H supports LTE CAT4 up to 150Mbps (DL).
  • Compact multi band LTE modules


  • The SIM7100E from SIMCom is an ultra compact multi band LTE module which is based on the Qualcomm MDM9215. This complete multi-band TDD-LTE/FDD-LTE/WCDMA/GSM/GNSS SMT type module is designed with a powerful ARM Cortex™ A5, QDSP6 core processors. It delivers 50Mbps-up and 100Mbps-down data rates on LTE FDD networks, fully backward compatible with existing WCDMA/HSPA networks.

    The
    SIM7100E has strong extension capability with rich interfaces including UART, USB2.0, SPI, I2C,Keypad, PCM, etc. With abundant application capabilities like TCP/UDP/FTP/FTPS/HTTP/HTTPS/SMTP/POP3 and MMS, the module provides much flexibility and ease of integration for customer's application.

    The miniPCIe type SIM7100E-PCIE is a SIM7100E module combined with a miniPCIE adapter
    board.


    Features
    •  Five band FDD-LTE B1/B3/B7/B8/B20
    •  Dual band TDD-LTE B38/B40
    •  Dual band UMTS/HSDPA/HSPA+ B1/B8
    •  Dual band GSM/GPRS/EDGE 900/1800MHz
    •  Qualcomm MDM9215 based
    •  ARM Cortex™ A5, QDSP6 core processors
    •  LTE: 50Mbps-up & 100Mbps-down
    •  Supply voltage: 3.4 to 4.2V
    •  Operating temperature: -40° to +85176C
    •  Control Via AT Commands or Gobi API
    •  Standalone GNSS
    •  SMT package, dimensions 30x30x2.9mm
    •  Embedded FTP/FTPS/HTTP/HTTPS/SMTP/POP3/DNS/MMS


    Applications
    •  Smart metering
    •  Healthcare and alarm products
    •  Mobile POS

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