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Features

    The PLAS9 provides global coverage and 3G/2G fallback on just two variants, the PLAS9-X and PLAS9-W. The module’s innovative RF concept enables extreme performance and sensitivity and connection stability. MIMO 2x2 antenna interfaces enable consistent performance and improved data speeds. With carrier aggregation, PLAS9 delivers enhanced peak user data rates and optimized use of spectrum for improved connectivity performance. Cinterion’s proprietary 156 LGA footprint enables optimized heat dissipation that prevents warping while allowing the freedom to select the most beneficial soldering paste and stencil height suited to each individual application.

    PLAS9-W: Hendeka-Band LTE-Advanced FDD: 700 MHz (B28A, B28B), 800 MHz (B20), 850 MHz (B5, B18, B19, B26), 900 MHz (B8), 1800 MHz (B3), 2100 MHz (B1), 2600 MHz (B7) Quad-Band LTE-Advanced TDD: 1900 MHz (B39), 2300 MHz (B40), 2500 MHz (B41), 2600 MHz (B38)

    PLAS9-X: Hexa-Band LTE-Advanced FDD: 700 MHz(B12/B17, B13, B29), 850 MHz (B5),1700 MHz (B4), 1900 MHz (B2)


Specifications

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Type of product LTE Cat.6 module   
Cellular Generation: 2G , 2.5G , 3G , 3.5G , 4G   
Standard: GSM , GPRS , EDGE , HSPA , LTE Cat.6   
Operating temperature -40 to 95 °C   
Application resources AT commands   
Package LGA-156   
Mounting SMT   
Antenna interface SMT pads   
SIM interface External   
Power Input voltage: 3.3 to 4.2 V   
Dimensions Length: 40.0 mm   
Width: 32.0 mm   
Height: 2.8 mm   







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