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CPU / SoC / Socket Intel LGA1700   
TDP (max.) 125   
Chipset Intel Q670   
Memory DDR5 x 5   
Storage SATA x 8 , M.2 (22*42/22*80 M-key) x 2   
Graphics Intel Graphics   
Video signal HDMI x 1 , DisplayPort x 1 , VGA x 1   
LCD interface LVDS Dual-channel 18/24-bit x 1 , Embedded DisplayPort   
Network & wireless LAN 1 Gbit x 2   
Expansion slots Mini PCIe x 4 , M.2 (30*42/30*52/22*42mm B-key) x 1 , M.2 (22*30mm E-key) x 1   
I/O 8-bit DIO   
Connections SATA 3: 8   
USB 2.0: 2   
USB 3.x: 3   
RS-232: 5   
RS-232/422/485: 1   
SIM card slot: 1   
Other connections TPM 2.0 , Line-in x 1 , Mic-in x 1 , Line-out x 1 , HDR Speaker , Micro SIM card x 1   
Operating temp. Min.: 0 °C   
Max.: 60 °C   
Cooling Active   
Form factor microATX   
Dimensions Length: 244 mm   
Width: 244 mm   
Input power +12 DC , ATX V   
Particularities Switchable USB power , Bootable rear USB , AMI BIOS   
Supported operating system Windows 10 , Windows 11   
Package contents SATA cable , COM cable , I/O shield , Board   







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Texim Europe BV: BTW/VAT Registration: NL814671871B01 | Dutch Chamber of Commerce: 08138443
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