These products allow a high assembly density, as they do not have to be soldered through the PCB. With their height of less than 8mm they can be mounted on small and compact boards. In order to ensure sufficient resistance force despite the surface mounting, these products have additional lateral plastic anchors and bonding points.
All-round graphic OLED modules for wide-ranging applications
High performance Panel PCs with Rockchip inside
Modular Panel PCs engineered for performance
At Texim Europe we constantly invest in people, gather knowledge and expand our worldwide network, so we can select quality components that suit every application in the industry.