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Features

    The compact EHS8 module offers the latest Java ME 3.2 client runtime platform optimized for resource-constrained M2M applications. It significantly reduces total cost of ownership (TCO) and development timelines by sharing internal resources such as memory, a large existing code base and proven software building blocks. The improved Java concept uses Multi MIDlet Java execution to simultaneously host and run multiple applications and protocols. An extended security concept with the latest TLS/SSL engine provides secure and reliable TCP/IP connectivity while an enriched internal flash file system enables free of charge firmware updates over-the-air (FOTA) when required.

    GENERAL FEATURES:

  • 3GPP Rel.7 Compliant Protocol Stack
  • Five Bands UMTS (WCDMA/FDD) Bands: 800, 850, 900, 1900 and 2100 MHz
  • Quad-Band GSM Bands: 850, 900, 1800 and 1900 MHz
  • SIM Application Toolkit, letter class “b”, “c”, “e” with BIP and RunAT support
  • Control via standardized and extended ATcommands (Hayes, TS 27.007 and 27.005)
  • TCP/IP stack access via AT command and transparent TCP/UDP services
  • Secure Connection with TLS
  • Internet Services TCP/UDP server/client, DNS, Ping, HTTP, FTP client
  • LGA pad soldering mount, MSL4
  • Supply voltage range 3.1 - 4.5 V, highly optimized for minimal power consumption
  • Dimension: 27.6 x 25.4 x 2.2 mm
  • Weight: 3 g
  • Operating Temperature: -40 °C to +90 °C


Specifications

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User selected specs
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Type of product 3G/HSPA module   
Cellular Generation: 2G , 2.5G , 3G , 3.5G   
Standard: GSM , GPRS , EDGE , HSPA   
Satellite Standard: GPS   
Band / Frequency Five band   
Operating temperature -40 to 90 °C   
Application resources Java , AT commands   
Package LGA   
Mounting SMT   
Digital interface USB 2.0 , UART , I2C , SPI   
Antenna interface SMT pads   
SIM interface External   
Power Input voltage: 3.1 to 4.5 V   
Certifications R&TTE , CE , GCF , FCC , PTCRB , IC , UL   
Dimensions Length: 27.6 mm   
Width: 25.4 mm   
Height: 2.2 mm   




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